
X-RAY SYSTEM
Laser owns a modern X-Ray machine for the inspection of devices even of large size. This allows making very interesting process controls, deeply accurate and targeted to an improvement of the production cycle, in all its phases. This analysis technique is also applied to the different assembling technologies of the electronic components, such as the SMD and PTH. This equipment, particularly – due to a 160 KV tube with a 750nm resolution – is able to verify the physical features of the butt joints in the cards analysing their quality, the inter-metal compounds, the Void percentage. It will also provide the failure analysis of the components, Wire-Bond and Die Attach further to the specific analysis of BGA and Flip-chip. In addition, final assembled pieces can be analysed, also those covered by resin, that couldn’t be inspected with other techniques. According to the customer’s request, a wide photographic or non- photographic documentation may be given, together with a document reporting all the tests and analysis carried out by the technical staff.